Not as easy ones Vias Tented Plugged Blind Buried Digikeys Latest Innovation. Also, basic SMD footprints (resistors, capacitors, inductors) were optimized for reflow soldering - which means smaller pads and occupied PCB space - they are in SMD library.Ĭomponents provided without any warranty, althought most of them were used in real designs. MacroFab Engineering Podcast - via Podcast Addict MacroFabs Engineering. If the chip generates a lot of heat, it may be a better choice to used tented vias directly under the footprints for better heat transfer.
Some components here are missed from DipTrace standard libraries (or at least were missed prior to DipTrace 3.0), some are awkwardly named in those libraries. Put vias in the masked (non-exposed) copper areas in order to avoid solder being stolen by capillary action.
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